深圳市歐奧電子科技有限公司
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<ul id="qqie6"></ul> 深圳市歐奧電子科技有限公司
閱讀：863發布時間：2022-7-20
PGY-UFS 4.0-PA, UFS Protocol Analyzer is the industry first working and tested UFS 4.0 Protocol Analyzer. It offers protocol data capture and debug of data across MPHY, UniPro and UFS protocol layers. It allows for instantaneous decoding of UFS, UniPro and MPHY layers with flexibility to correlate decoded data across these protocol layers. PGY-UFS 4.0-PA supports PWMG1 to HSG5B data rates and two TX, two RX lane decode. The active probe has minimum electrical loading on device under test (DUT) and captures protocol data without affecting the performance of DUT.
PGY-UFS 4.0-PA Protocol Analyzer support two lane data. Comprehensive on the fly decoding of UniPro & UFS data enables validation of communication between UFS host and device.
PGY-UFS 4.0-PA Protocol Analyzer allows Design and Test Engineers to obtain deep insight into UFS host and device communication. MPHY/UniPRO/UFS packet-based triggering allows specific protocol data capture and analysis. PGY-UFS Protocol analyzer instantaneously provides decoding of UFS, UniPro and MPHY layers with a correlation to MPHY, UniPro and UFS layers.
Solder down active probes allows probing the MPHY test points. This allows the design and test engineers to capture UFS traffic between the host and UFS memory with high signal fidelity. Today’s test engineers need to test the use case scenarios in their labs that mimic real-life use cases. The PGY-UFS 4.0-PA, UFS Protocol Analyzer has been designed to enable engineers to closely monitor and analyze the traffic between the host and the device while executing the various use case scenarios.
OIO system Corporation is a leading electronics company based in Hongkong. OIO's portfolio includes embedded components, such as DDR, eMMC and UFS chips, as well as test equipment, like UFS programmers, test stations and fixture for OTT customers.
OIO's further main product groups include application products, chips and flash memory application devices. OIO focuses on demanding markets in the areas of information and communication technology and automotive, industrial and consumer electronics.
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